Process porting and partial processing services

Power Semiconductor Porting Service

• -  Porting capability : IGBT, RC-IGBT, FRD, Power MOSFET and similar devices.
• -  Can accept consignment of each partial processing.
  • 6-inch wafer :
    Front-end processes such as epitaxy, oxidation, diffusion, CVD, CMP, lithography and etching
  • 6-inch/8-inch wafers:
    silicon wafer grinding (back grinding, TAIKO process), backside metallization, plating, testing, backside etching, backside ion implantation, backside sputtering, and laser annealing (available from September 2024).
  • 8-inch wafer: Bumping, WL-CSP